Capability for Rigid PCB
|
Item
|
Normal
|
Speciality
|
|
Max.Layer count
|
40L
|
52L
|
|
HDI Structure
|
1+N+1
2+N+2
3+N+3
4+N+4
….
Anylayer
|
N/A
|
|
Max.Single/Array Size
|
1500mm*700mm
|
2000*800mm
|
|
Min.Finished Board Thickness
|
2L： 0.15mm
4L： 0.30 mm
|
N/A
|
|
Max.Finished Board Thickness
|
6.50mm
|
8.00mm
|
|
Min.Core Thickness
|
0.04mm
|
0.03mm
|
|
Min.Cu Thickness(Based)
|
8um
(1/4 oz)
|
6um
(1/5 oz)
|
|
Max.Cu Thickness(Based)
|
450um
(15 oz)
|
510um
(17 oz)
|
|
Min. Mechanical Drill Size
|
0.15mm
|
0.127mm
|
|
Min. Laser Drill Size
|
0.075mm 0.10mm
|
N/A
|
|
Aspect Ratio
|
12:1
|
15:1
|
|
Min.Trace Width
|
0.04mm
|
0.03mm
|
|
Min.SMT/QFP Pitch
|
0.30mm
|
0.25mm
|
|
Min.BGA Pitch
|
0.30mm
|
0.25mm
|
|
Min.Solder Mask Dam Width
|
0.07mm
|
0.05mm
|
|
S/M Registration Tolerance
|
± 0.035mm
|
± 0.025mm
|
|
Trace Width Tolerance
|
± 20%
|
± 8%
|
|
Drilling Hole to Hole Accuracy
|
± 0.05mm
|
± 0.03mm
|
|
Routing Edge to Edge Accuracy
|
± 0.10mm
|
± 0.05mm
|
|
Punching Edge to Edge Accuracy
|
± 0.10mm
|
± 0.075mm
|
|
V-cut Edge to Edge Accuracy
|
± 0.10mm
|
± 0.075mm
|
|
PTH Tolerance
|
± 0.075mm
|
± 0.05mm
|
|
NPTH Tolerance
|
± 0.05mm
|
± 0.03mm
|
|
Registration(O/L)
|
± 0.04mm
|
± 0.03mm
|
|
Max.Test Points
|
80000
|
100000
|
|
Impedance Control Tolerance
|
± 8%
|
± 5%
|
|
Fabrication Standard
|
IPC-6012/6013/6016 Class2,3
Perfag 2E,3C
|
|
|
Surface Treatment
|
HASL(Pb/Sn or Lead-Free).
ENIG(Immersion Gold)：Ni≥100U”, Au≥2U”.
ENIG + OSP.
Hard gold plating： Ni≥100U”, Au≥30U”.
Immersion Sliver.
Immersion Sn.
Peelable glue mask.
Carbon ink.
|
|
Capability for FPC, Rigid-Flex
|
Item
|
Normal
|
Speciality
|
|
Layer Count
|
1-14L
|
1-20L
|
|
Min.Finished Board Thickness
|
FPC: 0.05mm
Rigid-Flex:0.1mm
|
N/A
|
|
Min.Trace Width
|
0.04mm
|
0.03mm
|
|
Min.Drill Size
|
Mech： 0.15mm
Laser：0.075mm
|
N/A
|
|
Min.Cu Thickness (Based)
|
12um
|
8um
|
|
Molding Tolerance
|
± 0.10mm
|
± 0.05mm
|
Capability for SMT
|
Item
|
Normal
|
|
Mount Range
|
01005 ~ □32mm Chip、SOP、QFP、CSP、BGA…
|
|
Mount Accuracy
Repeatability
|
±0.05mm
±0.03mm
|
|
Minimum Substrate
|
L50mm*W50mm
|
|
Maximum Substrate
|
L510mm*W460mm
|
|
Mounting Substrate Thickness
|
0.5 ～2.6mm
|
|
Technology
|
Lead Paste
Paste Lead-free
Dispense
|
